From prototype to production — we deliver mission-critical microelectronics with uncompromising quality for aerospace, defense, and medical applications.
Understand the fundamental difference between monolithic and hybrid approaches — and why hybrid integration remains the preferred choice for high-reliability applications in aerospace, defense, and medical electronics.
Read the GuideDeep-dive technical articles written by our process engineers — no marketing fluff, just actionable manufacturing intelligence.
Step-by-step screening sequence for Class B microelectronics — burn-in, thermal cycling, seal testing, and more.
DuPont and Heraeus paste systems, mesh counts, firing profiles, and layer-to-layer alignment tolerances for 6+ layer circuits.
Gold wire ball bonding vs aluminum wedge bonding — loop profiles, heel damage, pull testing, and shear strength specifications.
Epotek E-Jet dispensing, conductive epoxy cure profiles, void content standards by application class, and silver-filled vs diamond-filled compounds.
I/O mapping, power distribution, thermal management via substrate, and DFM feedback before prototype tooling — our full-turnkey process.
Low-temperature vs high-temperature co-fired ceramic — firing atmosphere, conductor paste compatibility, and microwave performance trade-offs.
"Their Lot 1 traceability and MIL-PRF-38534 compliance gave our DER the confidence to approve thebuild. Zero escapes in 3 years of production."
"We switched from a domestic competitor after their defect rate hit 2%. IHA delivered 18 months at <0.1% DPPM. The engineering support is exceptional."
"DFM feedback before prototype tooling saved us $80K in respins. They flagged thermal via issues our previous vendor missed entirely."
"Class 5,000 cleanroom and ITAR registration made them the only viable source for our radiation-hardened RF assemblies. Responsive and reliable."
We specialize in thick film alumina (96% and 99.6%), thin film on alumina and AlN, LTCC, HTCC, and organic PCB substrates. Our thin film line supports挑剔 conductor and resistor films for precision analog applications.
Every build gets a unique lot number tied to traveler records. We capture: incoming inspection data, component lot/date codes, assembly sequence, wire bond pull data, die attach void readings, hermetic seal test results, and final visual acceptance. Full traceability from wafer slice to delivery.
Yes. We maintain ITAR registration and are experienced with DFARS 252.225-7014 (dominated sources). Our QA team can provide Certificate of Conformance, First Article inspection per AS9102, and PPAP-level documentation packages.
Prototype runs from 1–25 units through full-rate production at 10,000+ units/year. Our NPI team handles quick-turn prototypes (2–3 week lead time) with the same engineering rigor as production builds.
Every RFQ includes a complimentary Design for Manufacturability review. Our process engineers flag thermal vias, fiducial placement, component keep-out zones, and assembly sequence concerns — typically within 48 hours of drawing receipt.
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