Hybrid Process Overview
HYBRID PROCESS OVERVIEW
With extensive experienced in bringing high technology RF and Microwave Microelectronic components such as Synthesizers, OCXOs, VCXOs, TCXOs, VCTCXOs, DROs, Frequency Translators, Clock Oscillators, Crystals, and portable signal generators. The frequency spectrum of our devices cover the range from 30Hz to 26GHz and our products are used in process control, industrial, marine, aerospace, industrial and military applications. GED maintains a position of leadership by continually expanding its capabilities. Today, the rapid evolution of microelectronic technology is a significant factor in the development of our customers equipment. Microelectronics provides greater design flexibility and higher performance plus faster development and lower production costs in small quantities, shorter time from concept to prototype, close quality control, improved reliability and a second source of supply.
WHAT WE DO
Hybrids are microelectronic circuits fabricated by a dynamic technology, constantly evolving and expanding. Hybrids are so designated because their components are generally a combination of active and passive elements mounted on an insulating substrate with interconnect pattern as listed below:
Thick Film interconnect on 96% alumina ceramic, or aluminum nitrideThis construction (see Figure 1) offers a method of fabricating a wide variety of electronic circuits in a form that is extremely compact and reliable.
Thin Film interconnect on 99% alumina ceramic, or aluminum nitride
Organic PWB (Duroid, Polyimide, TMM10)
Low Temperature Cofired Ceramic (LTCC)
High Temperature Cofired Ceramic (HTCC)
Silicon (MEMs, 3-D, through-silicon via (TSV))
Hybrid packages can accommodate a wide variety of passive and active components in die and packaged form. This includes thick and thin film resistors, single layer, multilayer and tantalum capacitors, inductor chips, transformers, opto-couplers, and semiconductors ranging from diodes, silicon and SiGe ICs, GaAs, GaN, and SiC transistors and integrated circuits to microprocessors and microcontrollers.
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THICK FILM PROCESS
HERMETIC SEAM SEALING
GED has extensive design, process, manufacturing, RF and Microwave testing and production experience in multilayer thick film substrates, LTCC, surface mount assembly, crystal oscillators, chip and wire hybrids, multichip modules and RF and Microwave Components and Modules as shown in Figure 2.
Automated electrical testing can be performed to ensure your product will meet your specifications.
Components are designed to meet the screening requirements of MIL-STD-883 and GED can perform Groups A, B, C and D QCI qualification.
Let us review your build to print solutions.
Put GED on your team and you'll get over 100 years of combined engineering and design expertise, along with extensive application experience, to work for you free. Our mission is to help you solve design problems, take the risk out of new opportunities and just do things better.
Click here to discuss your unique microelectronic project requirements with us today!
Figure 1 Simplified Manufacturing Flow Diagram
Figure 2 Complex Multi Chip Module in wire bond assembly